Semiconductor device



FIG. 1 is a front, top and right side perspective view of a first embodiment of a semiconductor device showing my new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof, the rear view being an identical image of FIG. 3 ;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side view thereof, the left side view being an identical image of FIG. 6 ;

FIG. 7 is a front, top and right side perspective view of a second embodiment of a semiconductor device showing my new design;

FIG. 8 is a rear, bottom and left side perspective view thereof;

FIG. 9 is a front view thereof, the rear view being an identical image of FIG. 9 ;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof; and,

FIG. 12 is a right side view thereof, the left side view being an identical image of FIG. 12 .

The broken lines illustrate portions of the semiconductor device that form no part of the claimed design. 

CLAIM The ornamental design for a semiconductor device, as shown and described. 